Integrated Silicon Solution IncIS64WV102416BLL-10MLA3Chip SRAM
SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 10ns 48-Pin TFBGA Automotive AEC-Q100
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| COMPONENTS | |
| Automotive | Yes |
| PPAP | Yes |
| 16M | |
| 1M | |
| 16 | |
| SDR | |
| 20 | |
| 1 | |
| Asynchronous | |
| 10 | |
| 2.4 | |
| 2.5|3.3 | |
| 3.6 | |
| 140 | |
| -40 | |
| 125 | |
| Automotive | |
| Mounting | Surface Mount |
| Package Height | 0.9(Max) mm |
| Package Width | 9 mm |
| Package Length | 11 mm |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| 48 | |
| Lead Shape | Ball |
| EDA / CAD Models |
Progetta dispositivi medici guidati dall'IA
White paper: consigli su progettazione e componenti e approfondimenti IA per soluzioni diagnostiche e terapeutiche più veloci e sicure.