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BournsSF-2410HI250T-2Fuses
Fuse Chip 2.5A 125V SMD Solder Pad 2410 Ceramic T/R cUL
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| SVHC | Yes |
| SVHC Exceeds Threshold | Yes |
| Automotive | No |
| PPAP | No |
| Chip | |
| Battery Protection|LCD Backlight Inverter|LCD Monitor|Notebook|PC Server|POE|POE+|Power Supply|White Goods | |
| 6.1 X 2.6 | |
| 2.5 | |
| 125 | |
| 125 | |
| 50@125VAC|50@125VDC|300@32VDC | |
| 16.771 | |
| 0.0317 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2.6 | |
| 6.1 | |
| 2.6 | |
| Ceramic | |
| Surface Mount | |
| 2410 |
| EDA / CAD Models |
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